條號NO.

項目

Items

測試條件

Test Conditions

標準

Criteria

2.3.1

接觸電阻Contact Resistance

無負載動作若干次之後，在12VDC 50mA條件下用電壓降法測量。

施加部位：端子—端子之間

Shall be measured at 12VDC 50mA by voltage drop method after some operations without load.

Applied position: Between terminal and terminal

100mΩ MAX

2.3.2

絕緣電阻Insulation resistance

測試電壓：500V/DC 100mA。

施加部位：1) 端子—端子之間；

          2) 端子—外殼之間。

Test voltage: 500V/DC 100mA

Applied position: 1)Between terminal and terminal

    2)Between terminal and ground

1000MΩmin/500V

2.3.3

耐壓

Voltage proof

下列試驗，電壓施加1分鐘  

1) 端子—端子之間：500VAC (50~60Hz)

Following test voltages shall be applied for 1 min.

1)Between terminal and terminal : 500VAC (50~60Hz)

沒有發生介質擊穿現象

No dielectric breakdown

shall occur

條號NO.

項目 

Items

測試條件

Test conditions

標準

Criteria

2.4.1

低溫Cold

在經受-40±3℃，96小時試驗之後，開關在常溫常濕條件下恢復1小時，然後在1小時內完成測量。要除去凝露。

After testing at -40±3℃ for 96 h, the switch shall be allowed to stand under normal room temperature and humidity condition for 1h, and then measurement shall be made within 1 h. water drops shall be removed.

見2.3

As shown in item 2.3

2.4.2

高溫Dry heat

在經受80±3℃，96小時試驗之後，開關在常溫常濕條件下恢復1小時，然後在1小時內完成測量。

After testing at 80±3℃for 96 h, the switch shall be allowed to stand under normal room temperature and humidity condition for 1h, and then measurement shall be made within 1 h.

2.4.3

鹽霧

Salt mist

在以下设定条件下进行实验:

The switch  shall be checked after following test:

1)  温度：35℃±2℃

   Temperature: 35℃±2℃

2)  盐溶液浓度：5±1%（质量百分比）

   Salt solution : 5±1%(solids by mass)

3)  时间：4h±1h

   Time: 4h±1 hour     

实验后的盐沉积物用水冲洗掉。

After test, salt deposit shall be removed by running water.

2.5.1

可焊性

Solder ability

開關在按下列條件試驗後進行檢查

1）焊錫溫度：255±5℃；

2）浸漬時間：3±0.5s；

    Switch test under such conditions and inspect after.

1）Variable temperature range ：255±5℃；

2）Dip time：3±0.5s；

沾錫面積應為浸漬面積的90%以上。

The area of dip tin should capture the 90% impregnated area

2.5.2

手工焊接

Hand

soldering

請按以下條件進行焊接：

1）焊錫溫度：≤350℃；

2）連續焊接時間：≤3 s；

Please practice according to below conditions:

1) Soldering temperature: 350℃ Max.

2）Continuous soldering time: 3 s Max.

2.5.3

波峰焊接条件

Peak soldering conditions

项目Item

条件 Condition

助焊剂附着量

Flux built-up

不附着于零部件贴装面的程度

Mounting surface should not be coated with flax

预热温度

Preheating temperature

印刷电路板焊接面的周围温度 100℃ max.

Ambient temperature of the soldered surface of PC board. 100℃ max.

预热温度时间

Preheating time

60s max.

焊接温度

Soldering temperature

260℃ max.

焊接浸渍时间

Continuous dipping time

5s max.

焊接次数

Number of soldering

2次以下

2 times max.

2.6.1

工作寿命

Operation life

根据下面的测试要求进行测试：

无负载；按动速率：100-120次/分钟

平均无故障寿命： 10,000次

Measurement shall be made following the test set forth below:

No resistance load; Rate of operation: 100-120times/min.;

Average fault-free life：10,000 cycles

接触电阻≤200mΩ触点跳动≤10ms

按力：初值的±30%

Contact resistance:

≤200mΩ

 Contact bounce:  

≤10ms

Operating Force:

initial value±30%

2.6.3

按力

OF

开关垂直于操作方向放置，在开关按键顶端中心逐渐施力，测量开关导通所需的最大力度。

The switch is placed perpendicular to the direction of the operation, gradually force in key top center of switch, measure maximum intensity when it conducted required.

600±50gf

2.6.4

最大行程

OT

开关垂直操作方向放置，以一个等于2倍按力的静负荷施加在开关按键顶端中心，测量顶端移动的距离

Switch at the vertical operating orientation placement, with a force equal to 2 times according to the static load applied on the switch button the top center, measure the top moving distance.

2.30±0.3mm

2.6.5

回弹力

Resilience

开关垂直于操作方向放置，在开关按键顶端中心下降至全行程后，测量顶端向自由位置转换的力度

The switch is placed perpendicular to the direction of the operation, the switch key top center fell to a full stroke, the converted measurement from the top of the intensity of free position.

600±50gf

2.6.6

静压力

static pressure

在开关垂直于操作方向的顶端施加小于 100N 的静态压力 1 分钟。

Apply a static pressure of less than 100N to the top of the switch perpendicular to the operating direction for 1 minute.

开关无任何机械性和电气性的损坏

No mechanical or electrical damage to the switch