ZLQ8A-SWPC-G12V-N waterproof IP65, features an 8mm cut-out size,collision protection level can withstand an impact energy of 5 Joules green LED SWITECH metal indicator light push button switch

No.序号

Qty数量

Name名称

Material 材料/Colour 颜色

1

1

Luminous Area 发光区域

PC

2

1

Housing外壳

Brass Ni plated、Cr/Aluminum alloy

黄铜镀镍、铬/铝合金氧化

3

1

O-ring O型圈

Silicone硅胶

4

1

Nut 固定螺帽

Brass Ni plated 黄铜镀镍

5

1

Base基座

PBT

6

2

LED terminal LED引脚

Electroplated silver plating电镀银

條號no.

項目

Items

測試條件

Test conditions

標準

Criteria

3.3.1

Contact

Resistance

接触电阻

To be measured between the two terminals associated with each switch pole.

与每个开关极相关的两个端子之间进行测量

100mΩMax.

100毫欧以下

3.3.2

Insulation

Resistance

绝缘电阻

Apply a voltage of 1000VDC for 1 min. to following portions after which measurement shall be made between terminals。

输入1000VDC 电压1分钟,按以下接触方法测试: 排脚相互之间。

1000MΩ min.

1000兆欧以上.

3.3.3

Dielectric

Strength

耐电压

AC 2000V (50-60HZ)for 1 min trip between terminals.

输入AC 2000V(50-60HZ)电压,1分钟,按以下接触方法测试:

排脚相互之间

Without damage to parts

Arcing or breakdown etc

没有绝缘破坏等异常

條號no.

項目 

Items

測試條件

Test conditions

標準

Criteria

3.4.1

Cold test

耐冷试验

The switch shall be stored at a temperature of -20±3℃ for 96 hours. Then the switch shall be maintained at standard atmospheric conditions for 1 hour after which measurement shall be made.

放置在温度-20±3℃中测试96小时后,再将放置在常温常濕的环境中1小时后进行测试.

There shall be no

deformation or cracks in

Molded part.

外观无异常,满足于机械、电器性能.

3.4.2

Heat test

耐热试验

The switch shall be stored at a temperature of 55±3℃ for 96 hours. Then the switch shall be maintained at standard atmospheric conditions for 1 hour after which measurement shall be made.

放置在温度55±3℃中测试96小时后,再将放置在常温常濕的环境中1小时后进行测试.

3.4.3

Humidity

test

潮濕试验

The switch shall be stored at a temperature of 40±2℃ and a humidity of 90% to 95% for 96 hours.then the switch shall be maintained at standard atmospheric condition for 1 hour after which measurement shall be made.

放置40±2℃的相对湿度为90%～95%环境中96小时后,再将放置在常温常濕的环境中1小时后进行测试.

3.4.4

Standard

conditions

测试标准状态

Unless otherwise specified, the standard range of atmospheric conditions for making measurements and tests are as follows:

(1)Temperature:40±2℃

(2)Relative Humidity:90~95%

(3)Time:96 hours.

在没有指定的情况下测试温度、湿度、气压如下:

(1)温度为40±2℃

(2)湿度为90~95%

(3)时间为96小时.

3.4.5

防水等级IP65

IP level 65

Prevent the invasion of sprayed water and prevent water sprayed from all directions from entering the product and causing damage

防止喷射的水侵入 ，防止来自各方向由喷嘴喷射出的水进入产品造成损坏

No water intrusion

没有水侵入

3.5.1

Operating

force

作动力

A static load shall be applied to the tip of actuator in operating direction.

沿动作方向推动胶柄至接近底部时之数值.

No action

3.5.2

Operation Travel

动作行程

Switch at the vertical operating orientation placement, with a force equal to 2 times according to the static load applied on the switch button the top center, measure the top moving distance.

开关垂直操作方向放置，以一个等于2倍按力的静负荷施加在开关按键顶端中心，测量顶端移动的距离.

No action

3.5.3

Panel Thickness

面板厚度

Applied to nut

适用于螺母

1~5mm

3.6.1

Life test

寿命试验

Measurements shall be made following the test forth below：

(1) 20mA 12VAC, 20mA 12VDC

(2) Electronics Life Test：40,000 h.

测试方法：

(1) 20mA 12VAC, 20mA12VDC

(2) 电气寿命测试:  40,000 h.

(1) Contact resistance:

≤500mΩ

(2) without damage to parts arcing or breakdown etc.

(1) 接触电阻≤500mΩ

(2) 测试后外表无损伤,并且满足机械性能

3.7.1

可焊性

Solder ability

開關在按下列條件試驗後進行檢查

1）焊錫溫度：255±5℃；

2）浸漬時間：2±0.5s；

Switch test under such conditions and inspect after.

1）Variable temperature range ：255±5℃；

2）Dip time：2±0.5s；

沾錫面積應為浸漬面積的90%以上。

The area of dip tin should capture the 90% impregnated area

3.7.2

手工焊接

Hand

soldering

請按以下條件進行焊接：

1）焊錫溫度：≤320℃；

2）連續焊接時間：≤3 s；

Please practice according to below conditions:

1) Soldering temperature: 320℃ Max.

2）Continuous soldering time: 3 s Max.

3.7.3

波峰焊接条件

Peak soldering conditions

项目Item

条件 Condition

助焊剂附着量

Flux built-up

不附着于零部件贴装面的程度

Mounting surface should not be coated with flax

预热温度

Preheating temperature

印刷电路板焊接面的周围温度 100℃ max.

Ambient temperature of the soldered surface of PC board. 100℃ max.

预热温度时间

Preheating time

60s max.

焊接温度

Soldering temperature

260℃ max.

焊接浸渍时间

Continuous dipping time

5s max.

焊接次数

Number of soldering

2次以下

2 times max.